Samtec offers extensive advanced package design and assembly capabilities as well as the ability to assist in choosing the best technology and materials for your specific application. In addition to substrate and package design, flip chip, die attach, wirebond and sealing, our capabilities also include thermal management, wafer dicing, lid attach and marking. Click the links to the right to view and/or download design guidelines for these processes. Please note that the dimensions included are designed to help release product to manufacturing as quickly as possible. Please contact us
if you have tighter requirements.