SAMTEC
MICROELECTRONICS

A unique blend of unmatched Signal Integrity
and IC Packaging expertise positions Samtec
to provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond.

ADVANCED IC PACKAGING
+
MICRO INTERPOSERS

STREAMLINED INTERCONNECT PATH

Advanced IC Packaging

Samtec Microelectronics is a world-class provider of complex package assembly, including precision die attach and ultra-fine pitch wirebonding, with expertise in packaging and substrate design, as well as stacked die, multi-chip modules, interposer integration, ceramics and organics.

Flip Chip

MAXIMUM DENSITY


Accuracy to +/-3 microns

Manual, semi-automated & automated

Ceramic, laminate, HiTCE and Si on Si substrates

Gold stud bump thermocompression flip chip

Solder flip chip (Eutectic, high Pb, Pb-free RoHs)

Thermocompression flip chip

Adhesive attach flip chip (anisotropic Z-axis adhesives and films)

Capillary and jet underfill

Die Attach

precision placement


Accuracy to +/-3 microns

Manual, semi-automated & automated

High speed, high accuracy dispense & placement systems

Fillet control per MIL-STD 883

Epoxy attach

Isotropic & anisotropic adhesives, low out-gassing, low stress & custom materials, UV cure adhesives, dicing die-attach films

Custom processing

Dispensed, tapes or preforms

CSAM validation: in-house acoustic microscopy analysis

Wirebond

ultra fine pitch


Ultra-fine pitch, ultra-low profile ball bond & wedge bond

Wire diameters from 0.0007" (19 µm) to 0.002" (50 µm) DIA

Gold (Au), Aluminum (Al), Platinum (Pt) and Copper (Cu)

SSB (stitch standoff on ball), security bonds and constant gap wedge bonding

Stacked die wire bonding

Multi-chip modules

Signal Integrity support

Finish

dam to seal


Automated or manual encapsulation

Dual-head dispensers

Temperature control of fluids and substrates

Low out-gassing, low stress & custom materials

Custom processing

Thermal or UV cure

CSAM validation: in-house acoustic microscopy analysis

Laser marking/ink marking

Conductive/non-conductive lids

Automated & manual lid attach

Hermetic sealing

Micro Interposers

Samtec's Z-Ray™ micro array interposers are ultra high density, low profile and highly customizable solutions for Board-to-Board, IC-to-Board and Cable-to-Board applications. Contact the Micro Interposer Group or click here for more information.

Ultra Low Profile

ultra micro design
 


Low profile 1,00 mm body height

Customs down to 0,50 mm height

One piece design

Customizable in X-Y-Z axes for ultra micro applications

Low normal force with high contact deflection


Ultra High Density

achieve more with less


Customer-specific pin counts for ultimate high density and speed flexibility

Choice of 0,80 mm or 1,00 mm pitch grid

ZA8 Series with up to 1,024 contacts per square inch

ZA1 Series with up to 625 contacts per square inch


Ultra Flexible

Extensive capabilities
 


Variety of standard and custom configurations including dual compression, solder ball and an array of sizes and shapes

Customer-specific stack heights, pin counts, insulator shapes and plating thicknesses




Ultra
Cool

process flexibility
 


Standard FR-4 core with PTHs

Formed spring-temper Gold plated BeCu bonded to core

Bonded cover layer creates a highly rugged system

Dual compression or single-compression with solder balls




Signal Integrity Support

Samtec's Signal Integrity Group is dedicated to helping you determine and implement the most streamlined signal path possible, offering full channel analysis and SI optimization, package and substrate design, as well as modeling, prototyping, test and debug capabilities. Contact the Signal Integrity Group to discuss your particular needs.

Signal Integrity Tools

Free • Online • EASY

 

Final Inch® pre-optimized BOR reference designs

Online real-time performance Simulator

Solutionator™ online mated connector set generator

Free online connector models, simulations, prints and reports, including SPICE, Touchstone and 3D models

PADs and OrCAD® libraries

Signal Integrity Support

in-house expertise

 

24/7 Signal Integrity EE support

Interpretation of test data & performance results

PCB layout, trace & routing recommendations

Ground pin assignment assistance

SI optimization strategies

On-request test data

Simple modeling, testing and simulations

Modeling & Prototyping

Fee-based services

 

Customized simulation models

Electromechanical modeling

Turnkey system & sub-system design & engineering

Research & development

Models for simulation: SPICE, IBIS, ADS, ELDO and Allegro®

Testing & verification

Teraspeed® Consulting

fee-based services

 

SI design solutions
from Silicon to Silicon

Advanced Packaging

Signal / Power Integrity

Electromechanical Modeling

Research and Development

Ansys Quick Start Training

DESIGN GUIDELINES

Flip Chip & Underfill, Precision Die Attach, Fine-Pitch Wirebonding, Dam & Encapsulation

Samtec offers extensive advanced package design and assembly capabilities as well as the ability to assist in choosing the best technology and materials for your specific application. In addition to substrate and package design, flip chip, die attach, wirebond and sealing, our capabilities also include thermal management, wafer dicing, lid attach and marking. Click the links to the right to view and/or download design guidelines for these processes. Please note that the dimensions included are designed to help release product to manufacturing as quickly as possible. Please contact us if you have tighter requirements.

Full Channel Solutions

Samtec is the only interconnect company in the world providing true full channel solutions: from the bare die, to an interface 100 meters away - and all insertion points in between.

Samtec's Signal Integrity Group is dedicated to helping you determine and implement the most streamlined signal path possible, offering full channel analysis and SI optimization, package and substrate design, as well as modeling, prototyping, test and debug capabilities. Contact the Signal Integrity Group to discuss your particular need, or visit the Signal Integrity Center for more inforamtion.

Click the links below to learn more about Samtec's full line of interconnect solutions and expertise.

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  • Signal Integrity
  • Micro Systems
  • Rugged Systems