Advanced Microelectronics Packaging

IC packaging we can handle, along with anything you might need leading up to that point, or after.

We’re here to make the process easy.



It’s our goal to make SI design easy, which is why we can address signal challenges from the bare die to an interface 100 meters away and all points in between. We offer microelectronics packaging capabilities, optics, pcb connectors, cable assemblies and components all with the live support, design tools, and service you’ve come to expect from Samtec.